View NXPSEMICONDUCTORS-PMEG3020CPA_6945818.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. product profile 1.1 general description planar maximum efficiency general applicat ion (mega) schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a sot1061 leadless sma ll surface-mounted device (smd) plastic package with medium power capability. 1.2 features and benefits ? average forward current: i f(av) 2a ? reverse voltage: v r 30 v ? low forward voltage ? exposed heat sink (cathode pad) for exce llent thermal and electrical conductivity ? leadless small smd plastic package with medium power capability ? aec-q101 qualified 1.3 applications ? low voltage rectification ? high efficiency dc-to-dc conversion ? switch mode power supply (smps) ? reverse polarity protection ? low power consumption applications ? battery chargers for mobile equipment 1.4 quick reference data [1] device mounted on a ceramic p rinted-circuit board (pcb), al 2 o 3 , standard footprint. pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier rev. 1 ? 24 august 2010 product data sheet table 1. quick reference data t j =25 c unless otherwise specified. symbol parameter conditions min typ max unit per diode i f(av) average forward current square wave; = 0.5; f = 20 khz t amb 75 c [1] --2a t sp 135 c--2a v r reverse voltage - - 30 v v f forward voltage i f = 2 a - 410 440 mv i r reverse current v r = 30 v - 485 2000 a
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 2 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 2. pinning information 3. ordering information 4. marking 5. limiting values table 2. pinning pin description simplified outline graphic symbol 1 anode diode 1 2 anode diode 2 3 common cathode transparent top view 12 3 006aaa438 12 3 table 3. ordering information type number package name description version pmeg3020cpa huson3 plastic thermal enhanced ultra thin small outline package; no leads; three terminals; body 2 2 0.65 mm sot1061 table 4. marking codes type number marking code pmeg3020cpa am table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per diode v r reverse voltage t j 25 c-30v i f(av) average forward current square wave; = 0.5; f = 20 khz t amb 75 c [1] -2a t sp 135 c-2a i frm repetitive peak forward current t p 1 ms; ? 0.25 - 7 a i fsm non-repetitive peak forward current square wave; t p =8ms [2] -9a
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 3 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier [1] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [2] t j =25 c prior to surge. [3] reflow soldering is the only recommended soldering method. [4] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [5] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [4] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . [5] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [6] soldering point of cathode tab. per device, one diode loaded p tot total power dissipation t amb 25 c [3] [4] -500mw [3] [5] -960mw [1] [3] - 1800 mw t j junction temperature - 150 c t amb ambient temperature ? 55 +150 c t stg storage temperature ? 65 +150 c table 5. limiting values ?continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit table 6. thermal characteristics symbol parameter conditions min typ max unit per device, one diode loaded r th(j-a) thermal resistance from junction to ambient in free air [1] [2] [3] - - 250 k/w [4] - - 130 k/w [5] --70k/w r th(j-sp) thermal resistance from junction to solder point [6] --12k/w
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 4 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier fr4 pcb, standard footprint fig 1. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values fr4 pcb, mounting pad for cathode 1 cm 2 fig 2. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aac415 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 006aac416 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 5 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 7. characteristics [1] when switched from i f = 10 ma to i r =10ma; r l = 100 ; measured at i r =1ma. ceramic pcb, al 2 o 3 , standard footprint fig 3. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aac417 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 10 10 2 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 table 7. characteristics t j =25 c unless otherwise specified. symbol parameter conditions min typ max unit per diode v f forward voltage i f = 100 ma - 220 - mv i f = 1 a - 335 370 mv i f = 2 a - 410 440 mv i r reverse current v r = 10 v - 120 - a v r = 30 v - 485 2000 a c d diode capacitance f = 1 mhz v r = 1 v - 170 - pf v r =10v - 60 - pf t rr reverse recovery time [1] -50-ns
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 6 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier (1) t j = 150 c (2) t j = 125 c (3) t j =85 c (4) t j =25 c (5) t j = ? 40 c (1) t j = 125 c (2) t j =85 c (3) t j =25 c (4) t j = ? 40 c fig 4. forward current as a function of forward voltage; typical values fig 5. reverse current as a function of reverse voltage; typical values f=1mhz; t amb =25 c fig 6. diode capacitance as a function of reverse voltage; typical values 006aac418 10 ? 2 10 ? 3 1 10 ? 1 10 i f (a) 10 ? 4 v f (v) 0.0 0.7 0.5 0.6 0.4 0.3 0.1 0.2 (1) (2) (3) (4) (5) 006aac419 v r (v) 030 20 10 1 10 ? 1 10 ? 2 10 ? 3 10 ? 4 10 ? 5 10 ? 6 i r (a) 10 ? 7 (1) (2) (3) (4) v r (v) 030 20 10 006aac420 100 200 300 c d (pf) 0
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 7 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier t j = 150 c (1) =0.1 (2) =0.2 (3) =0.5 (4) =1 t j = 125 c (1) =1 (2) =0.9 (3) =0.8 (4) =0.5 fig 7. average forward power dissipation as a function of average forward current; typical values fig 8. average reverse power dissipation as a function of reverse voltage; typical values fr4 pcb, standard footprint t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fr4 pcb, mounting pad for cathode 1 cm 2 t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 9. average forward current as a function of ambient temperature; typical values fig 10. average forward current as a function of ambient temperature; typical values i f(av) (a) 0.0 3.0 2.0 1.0 006aac421 1.4 p f(av) (w) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 (1) (2) (3) (4) v r (v) 020 15 510 006aac422 1.0 2.0 3.0 p r(av) (w) 0.0 (1) (2) (3) (4) t amb ( c) 0 50 100 150 175 125 75 25 006aac423 1.0 2.0 3.0 i f(av) (a) 0.0 (1) (2) (3) (4) t amb ( c) 0 50 100 150 175 125 75 25 006aac424 1.0 2.0 3.0 i f(av) (a) 0.0 (1) (2) (3) (4)
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 8 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier ceramic pcb, al 2 o 3 , standard footprint t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 11. average forward current as a function of ambient temperature; typical values fig 12. average forward current as a function of solder point temperature; typical values t amb ( c) 0 50 100 150 175 125 75 25 006aac425 1.0 2.0 3.0 i f(av) (a) 0.0 (1) (2) (3) (4) t sp ( c) 0 50 100 150 175 125 75 25 006aac426 1.0 2.0 3.0 i f(av) (a) 0.0 (1) (2) (3) (4)
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 9 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 8. test information the current ratings for the ty pical waveforms as shown in figure 9 , 10 , 11 and 12 are calculated according to the equations: with i m defined as peak current, at dc, and with i rms defined as rms current. 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. (1) i r =1ma fig 13. reverse recovery time test circuit and waveforms t rr (1) + i f t output signal t r t p t 10 % 90 % v r input signal v = v r + i f r s r s = 50 i f d.u.t. r i = 50 sampling oscilloscope mga881 fig 14. duty cycle definition t 1 t 2 p t 006aaa812 duty cycle = t 1 t 2 i fav () i m = i rms i fav () = i rms i m =
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 10 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 9. package outline 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . fig 15. package outline sot1061 09-11-12 dimensions in mm 0.65 max 2.1 1.9 1.6 1.4 0.35 0.25 0.45 0.35 2.1 1.9 1.1 0.9 0.3 0.2 1.05 0.95 1.3 2 3 1 table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 pmeg3020cpa sot1061 4 mm pitch, 8 mm tape and reel -115
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 11 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 11. soldering reflow soldering is the only recommended soldering method. fig 16. reflow soldering footprint sot1061 occupied area solder paste = solder lands dimensions in mm sot1061_fr solder resist 0.4 2.1 1.3 0.25 0.25 0.25 1.1 1.2 0.55 0.6 2.3 0.5 (2 ) 0.5 (2 ) 0.6 (2 ) 0.4 (2 ) 0.5 1.6 1.7 1.05
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 12 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 12. revision history table 9. revision history document id release date data sheet status change notice supersedes pmeg3020cpa v.1 20100824 product data sheet - -
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 13 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
pmeg3020cpa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 24 august 2010 14 of 15 nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pmeg3020cpa 2 a low v f dual mega schottky barrier rectifier ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 24 august 2010 document identifier: pmeg3020cpa please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 packing information . . . . . . . . . . . . . . . . . . . . 10 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 contact information. . . . . . . . . . . . . . . . . . . . . 14 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

▲Up To Search▲

Price & Availability of NXPSEMICONDUCTORS-PMEG3020CPA

	To Download NXPSEMICONDUCTORS-PMEG3020CPA Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .